: : 3D SOLDER PASTE MEASUREMENT SYSTEM

  Main Function £º

¡¤Three-dimensional resolution in sub microns
¡¤Can carry out several inspection tasks
¡¤One-Click reuses the program to repeat inspection
¡¤Analyses on arbitrary cross-section height after 3D scan
¡¤Statistical Process Control(SPC) software
¡¤Gerber image airmanship for fast fixed position
¡¤Have several tools for geometry measurement

  Inspection image
  Specification
Measurement Speed 1.92m©O/sec
Resolution Height: 0.87um; Lateral(X£¬Y):0.5um
Repeatability(3¦Ä) Height: below 1.5 ? , Volume : below 1%
Measurement Range 300(X)*300(Y)*28(Z)mm
Applicable Object Size Max 300(W)*600(D)*20(H)mm
Measurement Date display & manage

3D scan image view &
Cross-section view analysis .
The data of measurement result being kept to the database, useding for SPC analysis

SPC Software Cp, Cpk, Cr, X-bar/R Chart,
Operate System Windows 2000/XP(English or Korean version)
Power Single phase AC 220V, 60/50Hz
Dimension & Weight Dimension: 668(W) x 775(D) x 374(H) mm
Weight: 60kgf
 
Tel:(86-21)52400011

Fax:(86-21)52400907

 

Copyright 2005 CHAMTEK Inc.All Rights Reserved