: : CSP-capable BGA Ball Mounting System BA-1200
  Feature £º

¡¤Flexible transport and supply enables accommodation of all type of packages, including P-BGA, and T-BGA, as well as small BGA (CSP) packages.
¡¤The screen printing method with automatic positioning adjustment by image recognition is adopted. A mask cleaning unit is also provided as standard.
¡¤A shortened vacuum path and ball grid technologies developed at Athlete ensure stable and trouble-free ball mounting.
¡¤Ball stock is limited to no more than 20000, increasing the turnover rate to prevent corrosion contamination.
¡¤Ball alignment checks are executed using the sensing and image processing techniques.(Before and after mounting)

  Specification £º

 Substrate material

 Ceramic£¬ Plastic, Polyimide(TCP)£¬ Metal(Leadframe)

 Substrate Size

 80x230mm Max.

 Ball diameter

 ¦µ0.2 ¡« ¦µ1.0mm  

 Minimum ball pitch

 0.4mm

 Printing Accuracy

 ¡À50um Max.   

 Mounting accuracy

 ¡À50um Max.

 Pressure loading

 5 to 80N

 Image processing method

 Screen Printing /Ball mounting: Pattern matching using gray scale  values.
 Post mounting inspection: Color image processing method

 Air source

 0.49 MPa

 Vacuum source

 Built-in vacuum generator

 Power requirement

 3 phase 200VAC, 50/60 Hz,12KW

 Outer dimensions/Weight

 Printing unit: 770(W) x 1400(D) x 1750(H) mm / 770Kg
 Mounting unit: 900(W) x 1200(D) x 1750(H) mm / 800Kg
 Inspection unit: 700(W) x 1000(D) x 1750(H) mm / 700Kg

 
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