BA-1200W is a W-Level CSP ball mounting system that is designed to handle the 8 inches wafers without any specific carriers. Thanks to the unique partial ball mounting method, it can achieve reliable mass production of mounting the micro balls with finest pitches.
· 8 inches wafer-capable.
·The application of flux to the wafer is achieved by this screen printing method,ensuring position accuracy while maintaining high volume.
·Partial-ball mounting head makes the ball mounting task stable, and enables to mount micro balls with finest ball pitches.
· The missing balls auto re-working system is adopted after the inspection process.