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Flip Chip Bonder CB-1750 |
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| Feature £º |
| The CB-1750 is a fully automated flip chip bonder equipped with an automatic tool leveling function.
¡¤Mounting tact time 3.8 sec/chip. Mounting accuracy ¡À5um.
¡¤By adopting the automatic tool leveling mechanism, the tool and the substrate have a parallel accuracy of less than 5um.
¡¤Three type of bonding are possible. Solder bumps, conductive resin and ACF.
¡¤Au auto bump leveling function is available
¡¤Accommodates ATC (Automatic Tool Changing) |
| Specification £º |
Substrate material |
Glass, Ceramic, Glass epoxy, polyimide, etc |
Substrate Size |
150 x 250mm Max. |
Chip Size |
1
¡«
20mm2
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Chip supply method |
Expanded Wafer£º (8" Max. x 8 pcs)
Gel-pack£º (4" Max. x 8 pcs)
Chip tray£º (4" Max. x 16 pcs) |
¦Èaxis travel |
¡À5¡ã |
Head temperature |
Room temperature to 450¡æ
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Pressure loading |
5
¡«
500 N |
Stage heating temperature |
150¡æ
Max |
Air source |
0.49 MPa |
Vacuum source |
Built-in vacuum generator |
Power requirements |
3 Phase 200VAC, 50/60Hz, 8KW |
Outer dimensions |
2300(W) x 1500(D) x 1700(H) mm |
Weight |
Approx.1500 kg |
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