|
| : :
Dage Bondtester
series 4000
|
|
Dage bondtester is a modular multifunction bondtester, apply in semiconductor and PCB Assembly. it for pull and shear test application, to ensure maximum accuracy,
repeatability, and reproducibility
|
1 . Operator friendly and easy to use
2 . Motorized X,Y stage
3 . Workholders adapters accommodate standard lead frames, packages and substrates;
4 . Load Cartridge Option:
¡¡¡¡ A). Wire Pull £¨ Max:10Kg £© ;
¡¡¡¡ B). Tweezer Pull/Peel £¨ Max: 5Kg £© ;
¡¡¡¡ C). Ball shear £¨ Max: 250g £© ;
¡¡¡¡ D). Die shear £¨ Max: 100Kg £© ;
¡¡¡¡ E). Solder Ball shear £¨ Max: 5Kg £© ;
¡¡¡¡ F). Lead Pull £¨ Max: 10Kg £© and so on;
5 . Maximum load cartridge accuracy and repeatability to within 0.01% (100ppm)
6 . Advanced Electronics and Software Control
7 . Internal SPC software to provide basic analysis
8 . Additional options include Cold Bump Pull, Vectored Pull for CSP, Digital image capture and Auto testing for Ultra Fine Pitch Applications . |
| Specification: |
Machine footprint |
425(Width) x730(Depth) x670 £¨ Height £© |
Weight |
45Kg |
Power Supply |
Switchable 100/110V, 220/240V,AC 50/60Hz |
Pneumatic Supply |
4bar, 6mm OD/4mm ID plastic pipe |
Vacuum Supply |
Min. 500mm Hg plastic pipe |
Monitor |
VGA/SVGA |
X, Y axis accuracy |
+/- 10 um (50 mm XY Table Option) |
X, Y axis repeatability |
+/- 5 um (50 mm XY Table Option) |
X, Y axis resolution |
¡¶ 1um (50 mm XY Table Option) |
Z axis travel |
65 mm |
Z axis resolution |
+/- 0.125 um |
Z axis accuracy over full travel |
+/- 2 um |
Z axis accuracy over 2mm |
+/- 10 um |
Workholder working envelope |
220mm (X) X220mm (Y) X50mm (Z) |
Software control |
Windows2000TM / WindowsNTTM |
|
|
|
